Publications

Journal Papers

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• Qingxiang Zhao, Jiewen Lai, Xiaobing Hu, Henry K. Chu. Dual-Segment Continuum Robot with Continuous Rotational Motion along the Deformable Backbone. IEEE/ASME Transactions on Mechatronics (T-MECH). 2022. [doi] [pdf]
• Zhenxi Cui, Wanyu Ma, Jiewen Lai, Henry K. Chu, Yi Guo. Coupled Multiple Dynamic Movement Primitives Generalization for Deformable Object Manipulation. IEEE Robotics and Automation Letters (RA-L). 2022. [doi] [pdf]
• Jiewen Lai, Bo Lu, Qingxiang Zhao, Henry K. Chu. Constrained Motion Planning of A Cable-Driven Soft Robot with Compressible Curvature Modeling. IEEE Robotics and Automation Letters (RA-L). 2022. [doi] [pdf]
• Qingxiang Zhao, Jiewen Lai, Henry K. Chu. Reconstructing External Force on the Circumferential Body of Continuum Robot with Embedded Proprioceptive Sensors. IEEE Transactions on Industrial Electronics (T-IE). 2022. [doi] [pdf]
• Qingxiang Zhao, Jiewen Lai, Kaicheng Huang, Xiaobing Hu, Henry K. Chu. Shape Estimation and Control of a Soft Continuum Robot under External Payloads. IEEE/ASME Transactions on Mechatronics (T-MECH). 2021. [doi] [pdf]
• Jiewen Lai, Bo Lu, Henry K. Chu. Variable-Stiffness Control of A Dual-Segment Soft Robot using Depth Vision. IEEE/ASME Transactions on Mechatronics (T-MECH). 2021. [doi] [pdf]
• Jiewen Lai, Kaicheng Huang, Bo Lu, Qingxiang Zhao, Henry K. Chu. Verticalized-Tip Trajectory Tracking of A 3D-Printable Soft Continuum Robot: Enabling Surgical Blood Suction Automation. IEEE/ASME Transactions on Mechatronics (T-MECH). 2021. [doi] [pdf]
• Long Wei, Yat Sze Choy, Chun Shun Cheung, Henry K. Chu. Comparison of Tribology Performance, Particle Emissions and Brake Squeal Noise Between Cu-containing and Cu-free Brake Materials. Wear. vol. 466, p. 203577. 2021. [doi] [pdf]
• Kaicheng Huang, Zhenxi Cui, Jiewen Lai, Bo Lu , Henry K. Chu. Optimization of A Single-particle Micropatterning System with Robotic nDEP-Tweezers. IEEE Transactions on Automation Science and Engineering (T-ASE). 2021. [doi] [pdf]
• Kaicheng Huang, Ihab Abu Ajamieh, Zhenxi Cui, Jiewen Lai, James K. Mills, Henry K. Chu. Automated Embryo Manipulation and Rotation via Robotic nDEP-tweezers. IEEE Transactions on Biomedical Engineering (T-BME). vol. 68, no. 7, pp. 2152-2163. 2020. [doi] [pdf] [Featured Article]
• Bo Lu, Xinbo Yu, Jiewen Lai, Kaicheng Huang, Keith C. C. Chan, Henry K. Chu. A Learning Approach for Suture Thread Detection with Feature Enhancement and Segmentation for 3D Shape Reconstruction. IEEE Transactions on Automation Science and Engineering (T-ASE). vol. 17, no. 2, pp. 858-870. 2020. [doi] [pdf]
• Bo Lu, Henry K. Chu, Kaicheng Huang, Jiewen Lai, Li Cheng. Surgical Suture Thread Detection using a Model-free Approach in a Calibrated Stereo-visual System. IEEE/ASME Transactions on Mechatronics (T-MECH). vol. 25, no. 2, pp. 792-803. 2020. [doi] [pdf]
• Kaicheng Huang, Bo Lu, Henry K. Chu, Jiewen Lai. Microchip System for Patterning Cells on Different Substrates via Negative Dielectrophoresis. IEEE Transactions on Biomedical Circuits and Systems (T-BCAS). vol. 13, no. 5, pp. 1063-1074. 2019. [doi] [pdf]
• Bo Lu, Henry K. Chu, Kaicheng Huang, Li Cheng. Vision-based Surgical Suture Looping through Trajectory Planning for Wound Suturing. IEEE Transactions on Automation Science and Engineering (T-ASE). vol. 16, no. 2, pp. 542-556. 2019. [doi] [pdf]
• Guohua Bai, Ying Li, Henry K. Chu, Kaiqun Wang, Qiulin Tan, Jijun Xiong, Dong Sun. Characterization of Biomechanical Properties of Cells Through Dielectrophoresis‑Based Cell Stretching and Actin Cytoskeleton Modeling. BioMedical Engineering OnLine. vol. 16, no. 1, p. 41. 2017. [doi] [pdf]
• Zhijie Huan, Henry K. Chu, Hongbo Liu, Jie Yang, Dong Sun. Engineered Bone Scaffolds with Dielectrophoresis-based Patterning using 3D Printing. Biomedical Microdevices. vol. 19, no. 4, p. 102. 2017. [doi] [pdf]
• Zhijie Huan, Henry K. Chu, Jie Yang, Dong Sun. Characterization of a Honeycomb-Like Scaffold With Dielectrophoresis-Based Patterning for Tissue Engineering. IEEE Transactions on Biomedical Engineering (T-BME). vol. 64, no. 4, pp. 755-764. 2017. [doi] [pdf]
• Xiaofei Zhang,* Henry K. Chu*, Yang Zhang, Guohua Bai, Kaiqun Wang, Qiulin Tan, Dong Sun. Rapid Characterization of the Biomechanical Properties of Drug-Treated Cells in A Microfluidic Device. Journal of Micromechanics and Microengineering. vol. 25, no. 10, p. 105004. 2015. [doi] [pdf] (* equal contribution)
• Henry K. Chu, Zhijie Huan, James K. Mills, Jie Yang, Dong Sun. Three-dimensional Cell Manipulation and Patterning using Dielectrophoresis via a Multi-layer Scaffold Structure. Lab on a Chip. vol. 15, no, 3, pp. 920-930. 2015. [doi] [pdf]
• Haixia Liu, Ran Wang, Henry K. Chu, Dong Sun. Design and Characterization of a Conductive Nanostructured Polypyrrole-Polycaprolactone Coated Magnesium/PLGA Composite for Tissue Engineering Scaffolds. Journal of Biomedical Materials Research Part A. vol. 103, no. 9, pp. 2966-2973. 2015. [doi] [pdf]
• Henry K. Chu, James K. Mills, William L. Cleghorn. Automated Parallel Microassembly for MEMS Application. Journal of Micromechanics and Microengineering. vol. 22, no. 3, p. 035017. 2012. [doi] [pdf] [IOP Select Article Award]
• Henry K. Chu, James K. Mills, William L. Cleghorn. Image-based Visual Servoing Through Micropart Reflection For the Microassembly Process. Journal of Micromechanics and Microengineering. vol. 21, no. 6, p. 065016. 2011. [doi] [pdf]
• Henry K. Chu, James K. Mills, William L. Cleghorn. Parallel Microassembly Wth A Robotic Manipulation System. Journal of Micromechanics and Microengineering. vol. 20, no. 12, p. 125027. 2010. [doi] [pdf]
• Henry K. Chu, James K. Mills, William L. Cleghorn. MEMS-based Power Disconnect for 42-V Automotive Power Systems. Journal of Micro-Nanolithography MEMS and MOEMS. vol. 7, no. 1, p. 013010. 2008. [doi] [pdf]

Conference Papers

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• Qingxiang Zhao*, Zhiyi Jiang*, Henry K. Chu. A Soft-Rigid Air-Propelled Pipe-Climbing Robot. IEEE International Conference on Robotics and Automation (ICRA). pp. 11850-11855. 2021. [doi] [pdf] (* equal contribution)
• Bo Lu, Wei Chen, Yue-Ming Jin, Dandan Zhang, Qi Dou, Henry K. Chu, Pheng-Ann Heng, Yun-Hui Liu. A Learning-Driven Framework with Spatial Optimization For Surgical Suture Thread Reconstruction and Autonomous Grasping Under Multiple Topologies and Environmental Noises. IEEE International Conference on Intelligent Robots and Systems (IROS). pp. 3075-3082. 2020. [doi] [pdf]
• Zhenxi Cui, Kaicheng Huang, Bo Lu, Henry K. Chu. Automated Folding of a Deformable Thin Object through Robot Manipulators. IEEE International Conference on Intelligent Robots and Systems (IROS). pp. 4241-4248. 2020. [doi] [pdf]
• Kaicheng Huang, Zhenxi Cui, Ihab Abu Ajamieh, Jiewen Lai, James K. Mills, Henry K. Chu. Automated Single-microparticle Patterning System for Micro-analytics. IEEE International Conference on Automation Science and Engineering (CASE). pp. 390-396. 2020. [doi] [pdf]
• Jiewen Lai, Kaicheng Huang, Bo Lu, Henry K. Chu. Toward Vision-based Adaptive Configuring of A Bidirectional Two-Segment Soft Continuum Manipulator. IEEE/ASME International Conference on Advanced Intelligent Mechatronics (AIM). pp. 934-939. 2020. [doi] [pdf]
• Zhenxi Cui, Kaicheng Huang, Bo Lu, Henry K. Chu. Three-Dimensional Localization of Needle Tip Immersed in Medium. IEEE/ASME International Conference on Advanced Intelligent Mechatronics (AIM). pp. 507-512. 2019. [doi] [pdf]
• Jiewen Lai, Kaicheng Huang, Henry K. Chu. A Learning-based Inverse Kinematics Solver for a Multi-Segment Continuum Robot in Robot-Independent Mapping. IEEE International Conference on Robotics and Biomimetics (ROBIO). pp. 576-582. 2019. [doi] [pdf] [Best Paper Finalist Award]
• Kaicheng Huang, Henry K. Chu, Bo Lu, Jiewen Lai, Li Cheng. Automated Cell Patterning System with a Microchip using Dielectrophoresis. IEEE International Conference on Robotics and Automation (ICRA). pp. 634-639. 2019. [doi] [pdf]
• Kaicheng Huang, Henry K. Chu, Bo Lu, Li Cheng. Characterization of a Microchip Device for Cell Patterning via Negative Dielectrophoresis. IEEE International Conference on Robotics and Biomimetics (ROBIO). pp. 1521-1526. 2018. [doi] [pdf]
• Bo Lu, Henry K. Chu, Li Cheng. Robotic Knot Tying Through A Spatial Trajectory with a Visual Servoing System. IEEE International Conference on Intelligent Robots and Systems (IROS). pp. 5710-5716. 2017. [doi] [pdf]
• Bo Lu, Henry K. Chu, Li Cheng. Dynamic Trajectory Planning for Robotic Knot Tying. IEEE International Conference on Real-time Computing and Robotics (RCAR). pp. 180-185. 2016. [doi] [pdf]
• Zhijie Huan, Henry K. Chu, Jie Yang, Dong Sun. Dielectrophoresis-Induced Cell Patterning Using A New PLA Scaffold Made By 3D Printing. IEEE International Conference on Nanotechnology (NANO). pp. 853-856. 2016. [doi]
• Zhijie Huan, Henry K. Chu, Jie Yang, Dong Sun. 3D Cell Manipulation with Honeycomb-Patterned Scaffold for Regeneration of Bone-like Tissues. IEEE International Conference on Information and Automation (ICIA). pp. 1680-1685. 2014. [doi]
• Henry K. Chu, Zhijie Huan, James K. Mills, Jie Yang, Dong Sun. Conductive, Multilayer Scaffold with Micro-porous Structure for Tissue Engineering. IEEE International Conference on Robotics and Biomimetics (ROBIO). pp. 1886-1891. 2014. [doi]
• Henry K. Chu, Zhijie Huan, James K. Mills, Jie Yang, Dong Sun. Dielectrophoresis-based Automatic 3D Cell Manipulation and Patterning through a Micro-electrode Integrated Multilayer Scaffold. IEEE International Conference on Intelligent Robots and Systems (IROS). pp. 2003-2008. 2014. [doi]
• Zhijie Huan, Henry K. Chu, Jie Yang, Dong Sun. Automated Assembly of Biological Cells in A 3D Scaffold Via Dielectrophoresis Manipulation. IEEE International Conference on Information and Automation (ICIA). pp. 345-349. 2014. [doi]
• Hao Yang, Xue Gou, Henry K. Chu, Yong Wang, Dong Sun. Quantitative Analysis of Chemoattractant Gradient Induced Cell Migration Velocity and Automatic Controller Design. IEEE International Conference on Nanotechnology (NANO). pp. 742-746. 2014. [doi]
• Fuzhou Niu, Weicheng Ma, Xiangpeng Li, Henry K. Chu, Jie Yang, Haibo Ji, Dong Sun. Modeling and Development of a Magnetically Actuated System for Micro-Particle Manipulation. IEEE International Conference on Nanotechnology (NANO). pp. 127-130. 2014. [doi]
• Henry K. Chu, James K. Mills, William L. Cleghorn. Dual-arm Micromanipulation and Handling of Objects through Visual Images. IEEE International Conference on Mechatronics and Automation (ICMA). pp. 813-818. 2012. [doi]
• Henry K. Chu, James K. Mills, William L. Cleghorn. Fabrication of A Microcoil through Parallel Microassembly. IEEE International Conference on Robotics and Automation (ICRA). pp. 5050-5055. 2012. [doi]
• Henry K. Chu, James K. Mills, William L. Cleghorn. Automatic Micropart Re-Orientation Through Visual Tracking for Automated Micro-Assembly. Proc. of ASME International Mechanical Engineering Congress and Exposition (IMECE). vol. 10, pp. 213-220. 2012. [doi]
• Henry K. Chu, James K. Mills, William L. Cleghorn. Dynamic Tracking of Moving Objects in Microassembly Through Visual Servoing. IEEE International Conference on Mechatronics and Automation (ICMA). pp. 1738-1743. 2010. [doi]
• Henry K. Chu, James K. Mills, William L. Cleghorn. Microgripper Design For Use in Parallel Microassembly Processes. IEEE Microsystems and Nanoelectronics Research Conference (MNRC). pp. 61-64. 2009. [doi]
• Henry K. Chu, James K. Mills, William L. Cleghorn. MEMS Capacitive Force Sensor for Use in Microassembly. IEEE/ASME International Conference on Advanced Intelligent Mechatronics (AIM). pp. 797-802. 2008. [doi]
• Henry K. Chu, James K. Mills, William L. Cleghorn. Stereolithography As A Meso-Structure For Input Force Reduction To A Capacitive Force MEMS Sensor. Proc. SPIE MEMS/MOEMS Components and Their Applications IV. 64640Q. 2007. [doi]
• Henry K. Chu, James K. Mills, William L. Cleghorn. Design of a High Sensitivity Capacitive Force Sensor. IEEE Conference on Nanotechnology (NANO). pp. 29-33. 2007. [doi]
• Henry K. Chu, James K. Mills, William L. Cleghorn. Design of a Capacitive Force MEMS Sensor for Automotive Circuit Disconnect. Proc. Canadian Society of Mechanical Engineering (CSME) Forum. vol. 62, pp. 1-8. 2006.